CORSAIR TM30’s low viscosity allows it to easily fill microscopic abrasions and channels for peak thermal transfer.
Premium Zinc Oxide based thermal compound for optimal thermal performance.
Install new, or replace existing, thermal compounds on your CPU and GPU to improve heat transfer and lower temperatures.
Ultra-low thermal impedance lowers CPU temperatures vs common thermal paste.
Once installed, CORSAIR TM30’s high-stability liquid compound lasts for years with no drying, cracking or change in consistency.
Non-conductive, non-toxic and contains zero volatile compounds.
Details
Volume / Net Weight 3.5g
Thermal Conductivity 3.8 W/mK
Net Weight: 3g
Thermal Conductivity: 3.8 W/mK
Thermal Impedance: 0.01°C -in2/W
Viscosity: 2300K cPs
Specific Gravity: 2.5g/cm3
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